High-Performance Thick On-chip Hard Magnets for MEMS Applications
Authors : Yifan He, Chengju Yu, Samer Haider, Mohsen Zaeimbashi, Gregory Stephen, Jiawei Wang, Yuyi Wei, Huaihao Chen, Xianfeng Liang, Cheng Tu, Cunzheng Dong, Don Heiman, Baoxing Chen, Nian Xiang Sun
American Physical Society | Retrieved from Google Scholar
Publication date : 2019
Journal : APS March Meeting Abstracts
Volume : 2019
Pages : Y39. 013
Description :
We adopted two methods for thick on-chip hard magnets fabrication for MEMS application.(1) Dry packing of Nd 2 Fe 14 B powders. Nd 2 Fe 14 B powders were mixed with binder wax powders, then dry-packed into pre-etched trenches on silicon wafers under 10 MPa pressure and 100 C heating. An out-of-plane, in-situ magnetic field of 1000 Oe was applied during the process.(2) High pressure compression of Nd 2 Fe 14 B powders. Nd 2 Fe 14 B powders were packed into a metal mould and heated to 300 C with 850 MPa pressure applied. The sample was bonded onto the silicon chip with polyimide. The dry-packed Nd 2 Fe 14 B magnets showed a remanent out-of-plane magnetization of 330 emu/cc (B r= 0.42 T), a coercive field of 8.6 kOe (690 kA/m) and an energy product of 2.4 2. 6 MGOe (19-21 kJ/m 3). It is also found that the out-of-plane magnetic field can boost the remanent magnetization in that direction …